progress capability
| Process Capability | ||
| No. | Items | Process Capability |
| 1 | Grinding and Wafer sa ←≠←w Diameter | 4、5、6、8、12 inch |
| 2 | Min. Grinding Thickness&nβ $bsp; |
Min=50μm (8 inch ,12 i↔÷$nch ) |
| 3 | Min. Saw Street Width &n→₽bsp; ₽♣<; &nbsλp; £₹≤; |
Min=50μm |
| 4 | Min. Die bonding ch ₩ip size |
Min=250*250μm |
| 5 | Die Attach | INK、MAPPING |
| 6 | Die Bonding Method&n↑♦♦bsp; | Epoxy/Electricall÷φ≤εy insulating/Solder/₽<γ©DAF/WBC |
| 7 | Wire Bonding Method | Gold wire, Copper wire, Alloy ™≥wire、Aluminum wire |
| 8 | Au Wire Min. BPP♥™↓ (Bond Pad Pitch) | 43 μm |
| 9 | Au Wire Min. BPO (Bo∑₹₹nd Pad Opening) | 36 μm ×36 μm |
| 10 | Cu Wire Min. BPP (Bond₹≥♦ Pad Pitch) | 50 μm |
| 11 | Cu Wire Min£≥∞≈. BPO (Bond Pad Opening) ←>; | 40 μm ×40 μm |
| 12 | Al Wire Min. BPP (Bond Pad ✔♠ £Pitch) | 70 μm |
| 13 | Al Wire Min. BPO (Bond Pad Op∑↔§ening) | 250μm×385μm |
| 14 | Bonding Wi☆re diameter | 18μm ~ 50μm |
| 15 | Bonding Wire l¶©$ength | 0.1mm~6mm |
| 16 | Molding Method | Single Mold, MGP Mold, autom÷₹atic mold |
| 17 | Plating Method | Pure Tin Plating&nbs ✘<p; |
| 18 | Marking Method&nb₹εsp; | Laser printing |
| 19 | Forming and Singulation&n♥'bsp; | incision, pressing&n'₩bsp; |
| 20 | Testing | We can provide testing solution up<↕on customer’s reque >st |
| 21 | Lead Co-planarity | ＜3mil 小(xiǎ επλo)于75 um |
| 22 | Packaging Method ÷ΩΩ; | Tube, Tray, Tape λ±' & Reel |
| 23 | Bond pad metal for Au |
Min=Al 0.4μm |
| 24 | Bond pad metal for Cu |
Min=Al 0.8μm or AlCu &≤δ; AlSiCu 0.6μm |