Company conscientiously imφ₽plement all laws and regulations of en§←αvironmental protection↔±, strict enforcement of project eia, ✔<ε≤the "three simuε αltaneity" special accept>≠ance, and environmental protecti€₽↔on to implement environmental✔∑ management to the production an≠←d operation of each link'γ​≤, and to enhance investment in envi✘'÷≠ronmental protection and circular econo∏☆my, and greatly reduceΩ¥↓& emissions, reduce productiδ♦♣↑on cost, enhance the₩δ comprehensive compe π®titiveness of enterprises, and reduce t∑ he pollution to the environment, ​✔♠αhas the good economic ef♣±αficiency and social ben♠ efits and environmental benefit♦​s.

Company research, development, pro↕α×duction of integrated circuit λπpackaging products have‌®♣‌ DIP, SOP, SSOP, TSSOPσ‌δ♦, MSOP, QFP, LQFP, eL↕→★≈QFP, SIP, the TO, SOT, B♥♥&©GA, FC, TSV, LED, MEMS, and so on more∑• than 10 series over 180 varie§Ωties, capacity and sale&Ωs in the domestic pa♣≠£¶ckaging testing companies. 2. Packaging¶γβ& products are widely >®∑used in industrial control, consumer elγ‍ectronics, mobile co¶≥mmunications and other fields, pro§←ducts meet the require∏↔δ✔ment of green environmental prβ÷π&otection, and most compa•₩∑©nies for domestic integrated circuit pa>‍ckaging products. Compa​∑ny has a state-levelλ♠↑Ω enterprise technology center in gan&φsu province and microe€↓≤lectronics packaging e≈₹β"ngineering technologyε♥↑¥ research center, bu✔α≈ilt with microelectronics enΩ←gineering research laboσ♣ >ratory in gansu province, gansu provin​ εce, semiconductor lighting♠±α engineering laboratory and the re≤♠"liability of the dom&≈λ→estic first-class labo↑♠ratory.